Company Filing History:
Years Active: 2015
Title: Yuko Karasawa: Innovator in Wiring Substrate Technology
Introduction
Yuko Karasawa is a prominent inventor based in Nagano, Japan. She has made significant contributions to the field of semiconductor packaging through her innovative designs and methods. Her work has led to advancements in wiring substrate technology, which is crucial for modern electronic devices.
Latest Patents
Yuko Karasawa holds a patent for a wiring substrate, method for manufacturing wiring substrate, and semiconductor package. This patent describes a wiring substrate that includes a core layer, first and second wiring layers, and a first insulating layer. The core layer is made of aluminum oxide and features multiple linear conductors that penetrate the plate-shaped member. The first and second wiring layers are positioned to superpose each other, allowing for efficient electrical connections.
Career Highlights
Karasawa has been instrumental in her role at Shinko Electric Industries Co., Ltd. Her expertise in wiring substrate technology has positioned her as a key player in the semiconductor industry. With her innovative approach, she has contributed to the development of advanced electronic components that enhance device performance.
Collaborations
Yuko collaborates with talented coworkers, including Kazue Ban and Ryo Fukasawa. Their combined efforts in research and development have led to significant advancements in their field.
Conclusion
Yuko Karasawa's contributions to wiring substrate technology exemplify her innovative spirit and dedication to advancing semiconductor packaging. Her work continues to influence the industry and pave the way for future innovations.