Company Filing History:
Years Active: 1990-1991
Title: **Yukito Yamamoto: Innovator in Thermal Transfer Technologies**
Introduction
Yukito Yamamoto is a prominent inventor based in Sagamihara, Japan, known for his contributions to thermal transfer technologies. With two patents to his name, he has made significant advancements in the field, particularly through his work at Teijin Limited, a company recognized for its innovative materials and solutions.
Latest Patents
One of Yukito Yamamoto's notable inventions is a thermal transfer record sheet. This innovative sheet comprises a substrate sheet along with a dye receptive layer and a non-tacky layer arranged in a specific order on at least one surface of the substrate sheet. The dye receptive layer consists of a crosslinking reaction product derived from two key components: a saturated polyester featuring units from 2,2-bis(4-hydroxyphenyl)propane, which ensures a glass transition temperature of at least 60 degrees Celsius, and a polyisocyanate compound. Additionally, the non-tacky layer includes a water-insoluble or sparingly water-soluble fluorine-containing surface-active agent, characterized by a thickness ranging from 50 to 200 angstroms.
Career Highlights
Yukito Yamamoto has dedicated his career to advancing thermal transfer technologies, particularly during his tenure at Teijin Limited. His innovative mindset and technical expertise have enabled him to pioneer new methods that enhance the efficiency and effectiveness of thermal transfer applications.
Collaborations
Throughout his career, Yamamoto has worked closely with esteemed colleagues such as Takashi Yamagishi and Yoji Murakami. These collaborations have further enriched his work, allowing for an exchange of ideas and advancements in their respective fields.
Conclusion
In conclusion, Yukito Yamamoto stands out as a leading inventor in thermal transfer technologies. His patents and collaborative efforts at Teijin Limited underscore his invaluable contributions to innovation in this area. As he continues to develop new solutions, his work will undoubtedly influence the future of thermal transfer applications.
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