Tokyo, Japan

Yukihisa Kumeta



Average Co-Inventor Count = 3.7

ph-index = 2

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 1999-2002

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2 patents (USPTO):Explore Patents

Title: Innovations by Yukihisa Kumeta

Introduction

Yukihisa Kumeta is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of packaging technology, holding a total of 2 patents. His work focuses on improving the functionality and efficiency of packaging materials.

Latest Patents

Kumeta's latest patents include a "Wrapping Material Processor" and a "Process for Manufacturing Packing Container." The objective of these inventions is to prevent roughening of the rupture surface of a packaging material that occurs upon opening a spout. The technology involves transport means for moving a layered packaging material made of a paper substrate and resin films, which features a rupture area aligned with the opening means. A seal unit is employed to seal the packaging material, while heating means are positioned upstream of the seal unit to heat the innermost layer of the packaging material. This process allows the resin film to crystallize and become brittle, ensuring that when an external force is applied to open the spout, the packaging material ruptures cleanly without roughened edges.

Career Highlights

Yukihisa Kumeta is currently employed at Tetra Laval Holdings & Finance S.A., a company known for its innovative solutions in the food processing and packaging industry. His work at Tetra Laval has allowed him to develop and refine his inventions, contributing to advancements in packaging technology.

Collaborations

Kumeta has collaborated with notable coworkers such as Katsuji Magota and Katsuhiro Yamaguchi. Their combined expertise has fostered an environment of innovation and creativity within their projects.

Conclusion

Yukihisa Kumeta's contributions to packaging technology through his patents demonstrate his commitment to innovation and improvement in the industry. His work not only enhances the functionality of packaging materials but also sets a standard for future developments in the field.

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