Osaka, Japan

Yukihiro Uejima

This inventor holds 1 USPTO granted patent. Top assignee: Fujicopian Co., Ltd.. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yukihiro Uejima. Retrieved from https://idiyas.com/inventor/yukihiro-uejima

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Yukihiro Uejima: Inventor of a Heat-Sensitive Transfer Recording Medium

Introduction

Yukihiro Uejima is an inventor associated with Osaka, Japan, and Fujicopian Co., Ltd. His recorded patent work concerns a heat-sensitive transfer recording medium. The available information identifies 1 patent associated with him.

Latest Patents

Uejima’s listed patent, “Heat-sensitive transfer recording medium,” describes a substrate coated with a heat-sensitive transfer ink layer. The layer uses solvent-free hot-melt ink containing carbon black with a DBP oil absorption of 100 to 200 ml/100 g and a BET specific surface area of no more than 100 m²/g. The patent also specifies that the ink layer has a surface resistivity of no more than 10 Ω/□.

Career Highlights

Uejima’s documented invention focuses on the composition and electrical properties of a transfer medium designed for heat-sensitive recording. The patent connects his work with Fujicopian Co., Ltd., a company associated with recording and printing materials.

Collaborations

Yoshihide Kaneshiro and Seigo Kato are identified as Uejima’s coworkers. The available information does not specify their roles in the patent or describe particular joint projects.

Conclusion

Yukihiro Uejima’s recorded patent highlights his contribution to heat-sensitive transfer recording technology through a solvent-free ink layer with defined carbon-black and surface-resistivity properties.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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