Company Filing History:
2 out of 116 
2 out of 7 Years Active: 2007-2008
Title: Yukihiro Kaneda: Innovator in Heat Sink Technology
Introduction
Yukihiro Kaneda is a notable inventor based in Yokohama, Japan. He has made significant contributions to the field of semiconductor cooling technology. With a total of 2 patents, his work focuses on innovative methods for producing heat sinks.
Latest Patents
Kaneda's latest patents include a method for producing a heat sink designed for cooling semiconductor devices. This method involves forming multiple base members, each in a plate or block shape, with paths shaped on one or both sides of their surfaces. The base members are coated with a layer of gold (Au) and bonded together using a solder made of tin (Sn) or an Au–Sn alloy. This innovative design allows for a communicating flow path for a cooling medium, enhancing the efficiency of heat dissipation. Another patent focuses on a liquid-cooling type heat sink that boasts high pressure resistibility and resistance to corrosion. This design also incorporates a solder layer made of Au–Sn alloy or Sn, ensuring a robust bond between the base members.
Career Highlights
Throughout his career, Kaneda has worked with prominent companies such as Fuji Electric Systems Co. Ltd. and Tecnisco Limited. His experience in these organizations has contributed to his expertise in heat sink technology and semiconductor cooling solutions.
Collaborations
Some of Kaneda's notable coworkers include Atsushi Yanase and Masato Takahashi. Their collaboration has likely fostered innovation and development in their respective fields.
Conclusion
Yukihiro Kaneda's contributions to heat sink technology demonstrate his commitment to advancing semiconductor cooling methods. His innovative patents and career achievements highlight his role as a significant inventor in this field.