The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2007
Filed:
Sep. 13, 2004
Atsushi Yanase, Tokyo, JP;
Masato Takahashi, Tokyo, JP;
Yukihiro Kaneda, Yokohama, JP;
Fuji Electric Systems Co., Ltd., Tokyo, JP;
Tecnisco, Ltd., Tokyo, JP;
Abstract
The present invention provides a liquid-cooling type heat sink which has a high pressure-resistibility and is resistible against the corrosion or erosion-corrosion or electrolytic etching, and a method for its production. The heat sink of the present invention comprises plural base membersandthe base member being each in plate or block-shape, the base member each having pathsshaped on one or both sides of surfaces thereof, and the base members being bonded to each other, wherein a communicating flow pathincluding paththrough holesandis formed for a cooling medium to flow in and out. The base members are bonded to each other with a solder layermade of Au—Sn alloy or Sn, while a coating layer of Auis formed on each of the inner surfaces of the bonded base members. At the time of making a bond between the base members, the coating layer of Auand the solder layerare diffused to each other, resulting in formation of a bond layer of alloycontaining at least 91 wt % of Au and at most 9 wt % of Sn.