Yuki Kimoto

Title: Yuki Kimoto and Resin Composition for Circuit Boards.

Introduction

Yuki Kimoto is an inventor associated with Shibukawa, Japan, and Denka Company Limited. Kimoto’s patent work addresses materials for metal-base circuit boards, with a focus on balancing thermal, electrical, and mechanical performance.

Latest Patents

The supplied information lists 1 patent for Kimoto: “Resin Composition for Circuit Board, and Metal-Base Circuit Board in Which Same Is Used.” The invention describes a resin composition intended to help metal-base circuit boards achieve solder crack resistance, thermal conductivity, adhesion, and insulation.

The composition combines two types of vinylsilyl group-containing polysiloxanes with a hydrosilyl group-containing polysiloxane and an inorganic filler. It specifies molecular-weight ranges and proportions for the polysiloxanes, a filler content of 60 to 80 percent by volume, and a hydrosilyl-to-vinylsilyl molar ratio of 2.5 to 5.0. These formulation parameters are designed to support the stated performance properties of the circuit board.

Career Highlights

Kimoto’s listed patent reflects work on polymer-based materials for electronic circuit boards. The invention’s focus is the formulation of an insulating resin layer that can also support heat transfer and resist cracking around soldered areas.

Collaborations

The supplied information identifies Taiki Nishi and Ikuo Suyama as Kimoto’s coworkers. It does not specify their roles in the patent or the extent of their collaboration.

Conclusion

Yuki Kimoto’s listed invention contributes a carefully specified resin composition for metal-base circuit boards, aiming to combine insulation, thermal conductivity, adhesion, and solder crack resistance.