Yuki Itakura

Title: Yuki Itakura: Innovator in Copper Electrolytic Plating Technology

Introduction

Yuki Itakura is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of electroplating, particularly in the development of copper electrolytic plating technologies. His innovative work has led to advancements that enhance the physical properties of plating films.

Latest Patents

Yuki Itakura holds a patent for a copper electrolytic plating bath and copper electrolytic plating film. This invention provides a technology that allows for the co-deposition of sulfur to be significantly suppressed in copper electrolytic plating containing silver ions as an alloy component. The resulting copper electrolytic plating film exhibits excellent physical properties, such as strength and hardness, even after high-temperature heat treatment at approximately 200°C or higher. The patent describes a copper electrolytic plating bath that includes copper ions, an acid, chloride ions, and a complexing agent, with silver ions incorporated as an alloy component. Methionine or a derivative thereof is used as the complexing agent.

Career Highlights

Yuki Itakura is associated with Cuyemura Co., Ltd., where he continues to innovate in the field of electroplating. His work has been instrumental in advancing the technology used in various applications, making significant impacts in the industry.

Collaborations

Yuki Itakura has collaborated with notable colleagues, including Naoyuki Omura and Kazunari Kato. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Yuki Itakura's contributions to copper electrolytic plating technology exemplify the importance of innovation in enhancing material properties. His patent reflects a significant advancement in the field, showcasing his expertise and commitment to improving electroplating processes.