This inventor holds 1 USPTO granted patent. Top assignee: Tokuyama Corporation. Active years: 1997.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1997
Title: Yuka Kato: Innovator in Semiconductor Packaging
Introduction
Yuka Kato is a prominent inventor based in Tokuyama, Japan. She has made significant contributions to the field of semiconductor packaging. Her innovative approach has led to the development of a unique package for mounting semiconductor devices.
Latest Patents
Yuka Kato holds 1 patent for her invention titled "Package for mounting a semiconductor device." This patent describes a package that comprises a base plate and a conductive layer laminated onto the base plate via an adhesive layer. Notably, the modulus of elasticity at 25°C of the adhesive layer is 10 kg/mm² or less, which enhances the performance and reliability of semiconductor devices.
Career Highlights
Yuka Kato is currently employed at Tokuyama Corporation, where she continues to push the boundaries of innovation in semiconductor technology. Her work has been instrumental in advancing the efficiency and effectiveness of semiconductor packaging solutions.
Collaborations
Yuka has collaborated with notable colleagues, including Tokio Okoshi and Hideki Okoshi, who have contributed to her research and development efforts.
Conclusion
Yuka Kato's contributions to semiconductor packaging exemplify her innovative spirit and dedication to advancing technology. Her work not only enhances the performance of semiconductor devices but also sets a benchmark for future innovations in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile