Yujin Shin

Title: Yujin Shin and Temporary Sheet Bonding Technology.

Introduction

Yujin Shin is an inventor associated with Asan-si, South Korea, and Corning Incorporated. His patent work includes a method and apparatus for temporarily bonding sheets using a surfactant-containing bonding solution.

Latest Patents

Shin is credited with 1 patent: “Temporary Sheet Bonding Method and Apparatus.” The method dip-coats a temporary bonding layer onto a first sheet by immersing it in a bonding solution containing a surfactant, then temporarily bonds a second sheet to the first through that layer. The surfactant may include cetyltrimethylammonium bromide or poly[(3-methyl-1-vinylimidazolium chloride)-co-(1-vinylpyrrolidone)].

The associated apparatus includes a bonding-solution bath, a cassette for holding multiple first sheets, and a driver that moves the cassette. The driver immerses the sheets in the solution, lifts them out, and then moves the cassette away from the solution’s surface.

Career Highlights

Shin’s listed patent reflects work on sheet processing and temporary bonding. The apparatus’s cassette-based dipping sequence is designed to apply the bonding solution to multiple sheets.

Collaborations

Shin’s listed coworker is JooYoung Lee. The patent information provided does not specify the nature or extent of their collaboration.

Conclusion

Yujin Shin’s patent describes a surfactant-based approach to temporarily bonding sheets, supported by an apparatus designed to dip-coat multiple sheets in sequence.