Yuji Terashima

Title: Yuji Terashima: Innovator in Copper Polishing Technology

Introduction

Yuji Terashima is a notable inventor based in Nagano, Japan. He has made significant contributions to the field of materials processing, particularly in the polishing of copper layers on substrates. His innovative methods have the potential to enhance manufacturing processes in various industries.

Latest Patents

Yuji Terashima holds a patent for a method of polishing a copper layer of a substrate. This method is designed to improve the stock removal rate and involves several key steps. It includes supplying a substrate onto a polishing pad with the copper layer facing the pad, pressing the substrate onto the pad with a backing pad, and rotating the press head relative to the polishing plate while supplying polishing slurry. The backing pad is made from a material with an Asker C hardness of 75-95 and a compressibility of 10% or less. The polishing slurry contains a chelating agent for copper, an etching agent, an oxidizing agent, and water.

Career Highlights

Throughout his career, Yuji Terashima has focused on developing advanced techniques for substrate processing. His work has been instrumental in improving the efficiency and effectiveness of polishing methods, which are crucial in the electronics and semiconductor industries.

Collaborations

Yuji has collaborated with several professionals in his field, including Noriko Miyairi and Yasuo Inada. These collaborations have contributed to the refinement and application of his innovative polishing methods.

Conclusion

Yuji Terashima's contributions to the field of copper polishing technology highlight his role as a significant inventor. His patented methods are poised to make a lasting impact on manufacturing processes.