Yuji Shintomi

Title: Yuji Shintomi: Innovator in Circuit Design

Introduction

Yuji Shintomi is a prominent inventor based in Yokohama, Japan. He has made significant contributions to the field of circuit design, particularly in the area of multi-die modules. His innovative approach has led to the development of efficient interconnect layouts for integrated circuits.

Latest Patents

Yuji Shintomi holds a patent for a "Serial-bus interface for multi-die module." This invention focuses on circuits and methods that enhance the interconnect layout of multiple circuit elements, including integrated circuits (ICs), within a circuit module. The patent enables a single control/status (C/S) connection per module, streamlining communication between components. The first embodiment of the patent configures the C/S interfaces of multiple ICs in parallel within a multi-IC module, connecting them through a single module serial bus to a system C/S serial bus. The second embodiment couples the C/S interface of a primary IC through a single module serial bus, while a secondary IC is internally serially coupled to a 'pass through' interface of the primary IC. The third embodiment introduces a dynamic address translation circuit that translates device and register address information from a master device into corresponding internal addresses, redirecting command messages from a system C/S serial bus to internal slave devices.

Career Highlights

Yuji Shintomi is currently employed at Psemi Corporation, where he continues to innovate in the field of circuit design. His work has been instrumental in advancing the capabilities of integrated circuits and enhancing their efficiency.

Collaborations

Yuji collaborates with David Alan Podsiadlo, contributing to the development of cutting-edge technologies in their field.

Conclusion

Yuji Shintomi's contributions to circuit design and his innovative patent demonstrate his commitment to advancing technology in the electronics industry. His work continues to influence the development of efficient interconnect systems for integrated circuits.