Shiga, Japan

Yuji Kamide

This inventor holds 1 USPTO granted patent. Top assignee: Toyota Boshoku Kabushiki Kaisha. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuji Kamide. Retrieved from https://idiyas.com/inventor/yuji-kamide

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Yuji Kamide: Innovator in Skin Material Technology

Introduction

Yuji Kamide is a notable inventor based in Shiga-Ken, Japan. He has made significant contributions to the field of material science, particularly in the development of innovative skin materials.

Latest Patents

Kamide holds a patent for a skin material, which includes a design layer and a base cloth layer. The design layer consists of a surface layer and a foam layer, while the base cloth layer includes a surface fabric and a back fabric, bound together by a thermoplastic resin fiber. This unique construction creates a gap between the surface fabric and the back fabric, enhancing the material's properties. The method for producing this skin material involves joining the surface layer and the base cloth layer using a foamable adhesive.

Career Highlights

Yuji Kamide is currently employed at Toyota Boshoku Corporation, where he continues to innovate in the field of materials. His work focuses on creating advanced materials that can be utilized in various applications, particularly in the automotive industry.

Collaborations

Kamide collaborates with talented coworkers, including Ryo Yamane and Tsuyoshi Yamaguchi, to further enhance the development of innovative materials.

Conclusion

Yuji Kamide's contributions to skin material technology exemplify the importance of innovation in material science. His patent and ongoing work at Toyota Boshoku Corporation highlight his commitment to advancing this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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