Osaka, Japan

Yuichiro Kanzaka

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.4

ph-index = 1


Company Filing History:


Years Active: 2025

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2 patents (USPTO):Explore Patents

Title: Yuichiro Kanzaka - Innovator in Heat-Shrinkable Technology

Introduction

Yuichiro Kanzaka is a distinguished inventor based in Osaka, Japan, known for his innovative contributions to the field of packaging materials. With a focus on developing advanced heat-shrinkable films, Kanzaka has successfully patented a product that addresses specific challenges in container packing.

Latest Patents

Kanzaka holds a notable patent for a heat-shrinkable film and label designed to cater to containers with significant diameter discrepancies between their body and mouth sections. His invention allows for adequate shrinking in the mouth section while minimizing wrinkles and sink marks. The film is made from polyester and contains a dicarboxylic acid component with over 95 mol % of terephthalic acid, while the diol component includes at least 50 mol % of ethylene glycol and a minimum of 15 mol % of cyclohexanedimethanol. Its performance is impressive, showing a shrinkage rate of 20% or less at 70° C, 45% to 65% at 80° C, and 65% or more at 98° C when immersed in hot water for 30 seconds.

Career Highlights

Currently employed at C.I. Takiron Corporation, Kanzaka has established himself as a key player in the field of innovative packaging solutions. His work not only aids in improving product presentation but also enhances efficiency and functionality in the packaging industry.

Collaborations

Throughout his career, Kanzaka has collaborated with talented colleagues, including Takuma Kaneko and Masahiro Watanabe. These partnerships have facilitated an exchange of ideas and expertise, further refining their contributions to the field.

Conclusion

Yuichiro Kanzaka’s innovative spirit and dedication to developing high-quality packaging solutions have positioned him as a notable inventor in Japan. His patented heat-shrinkable film reflects his commitment to addressing real-world challenges in packaging while paving the way for future advancements in this vital industry.

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