Company Filing History:
Years Active: 2018
Title: Innovator Yuichiro Azuma: Pioneering Advances in Die-Bonding Technology
Introduction
Yuichiro Azuma, an innovative inventor based in Tokyo, Japan, has made significant contributions to the field of semiconductor technology. With a focus on the development of advanced die-bonding layer formation films, his work is pivotal in enhancing the reliability and effectiveness of electronic devices.
Latest Patents
Yuichiro Azuma holds a noteworthy patent titled "Die-bonding layer formation film, processed product having die-bonding layer formation film attached thereto, and semiconductor device." This patent describes a die-bonding layer formation film designed for fixing a processed product to an adherend. The film includes an adhesive layer characterized by a storage elastic modulus that achieves a local minimum value at temperatures ranging from 80°C to 150°C. Additionally, the adhesive layer shows a shear strength of 20 N/2 mm or more and 50 N/2 mm or less, ensuring robust performance even when subjected to thermal conditions.
Career Highlights
Throughout his career, Yuichiro has worked diligently at Lintec Corporation, where his expertise in material science and semiconductor technology has been invaluable. His contributions have led to advancements in product reliability and performance, thereby bolstering the company's reputation in the industry.
Collaborations
Yuichiro Azuma is known for his collaboration with colleagues Hideaki Suzuki and Naoya Saiki. Together, they have combined their knowledge and skills to push the boundaries of innovation in the field of die-bonding technologies and semiconductor devices.
Conclusion
Yuichiro Azuma stands out as a leading inventor in the realm of semiconductor technology. His patent on die-bonding layer formation films exemplifies his commitment to innovation and excellence. As technology continues to evolve, Yuichiro's contributions may very well shape the future of electronic devices, enhancing performance and reliability across various applications.