This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Nippon Steel Chemical Co., Ltd.. Active years: 2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2008
Title: Yuichi Tokuda: Innovator in Hinge Board Technology
Introduction
Yuichi Tokuda is a notable inventor based in Chiba, Japan. He has made significant contributions to the field of flexible wiring technology, particularly through his innovative patent related to hinge boards.
Latest Patents
Yuichi Tokuda holds a patent for a hinge board and method for producing the same. This invention features a hinge board that includes a hinge bending part and a rigid part. The design incorporates at least two flexible wiring boards, which consist of a polyimide sheet layer, a conductor layer with circuits formed on one or both sides, and a coverlay film layer. The flexible wiring boards are bonded together in the rigid part using a bonding material, creating a space in the hinge bending part.
Career Highlights
Tokuda is associated with Nippon Steel Chemical Co., Ltd., where he has been able to apply his expertise in developing advanced materials and technologies. His work has contributed to the enhancement of flexible wiring solutions in various applications.
Collaborations
Yuichi Tokuda has collaborated with notable colleagues, including Takashi Tanaka and Hidenori Nakajima. Their combined efforts have fostered innovation and development in their respective fields.
Conclusion
Yuichi Tokuda's contributions to hinge board technology exemplify the importance of innovation in the electronics industry. His patent reflects a significant advancement in flexible wiring solutions, showcasing his role as a key inventor in this domain.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile