This inventor holds 1 USPTO granted patent. Top assignee: Mcmaster University. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yuhang Yang: Innovator in Power Semiconductor Packaging
Introduction
Yuhang Yang is a notable inventor based in Hamilton, Canada. He has made significant contributions to the field of power semiconductor devices, particularly through his innovative patent.
Latest Patents
Yuhang Yang holds a patent for a technology titled "Silver sintered molybdenum (SSM) packaging for power semiconductor devices." This patent describes a method of manufacturing SSM packaging that includes a substrate and a MOSFET die. The first side of the MOSFET die is bonded to the substrate using nano silver sintering. Additionally, at least two leads are connected to the substrate and the MOSFET die, utilizing nano silver sintering for bonding. Each component is formed of pure molybdenum, enhancing the efficiency and reliability of power semiconductor devices.
Career Highlights
Yuhang Yang is affiliated with McMaster University, where he continues to advance research in semiconductor technology. His work has garnered attention for its potential applications in various electronic devices.
Collaborations
Yuhang Yang collaborates with Ali Emadi, a fellow researcher, to further explore innovations in the field of power electronics.
Conclusion
Yuhang Yang's contributions to power semiconductor packaging demonstrate his commitment to advancing technology in this critical area. His innovative patent reflects the potential for improved efficiency in electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile