Yuet Cheung

Title: Innovations by Yuet Cheung in Bonding Technology

Introduction

Yuet Cheung is an accomplished inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding technology, particularly with his innovative patent that enhances the precision of die bonding processes. His work is recognized for its practical applications in the semiconductor industry.

Latest Patents

Yuet Cheung holds a patent for an "Apparatus and method of determining a bonding position of a die." This invention provides an apparatus that includes a bond head for picking up and bonding the die. The apparatus is equipped with a plurality of cameras that are strategically positioned to capture multiple images of the die. These images include a first image of the first side surface, a second image of the second side surface, and a third image that encompasses both side surfaces. The method outlined in the patent determines the bonding position of the die based on the captured images, thereby improving the accuracy and efficiency of the bonding process.

Career Highlights

Yuet Cheung is currently employed at Asm Technology Singapore Pte Ltd, where he continues to innovate and develop advanced technologies in the semiconductor sector. His expertise and dedication to his work have made him a valuable asset to his company.

Collaborations

Yuet collaborates with talented colleagues, including Kui Kam Lam and Shun Ming Fung. Their combined efforts contribute to the advancement of technology in their field.

Conclusion

Yuet Cheung's innovative work in bonding technology exemplifies the impact of dedicated inventors in the semiconductor industry. His patent not only showcases his ingenuity but also serves as a foundation for future advancements in die bonding processes.