Shanghai, China

Yuelin Zhao


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2017

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2 patents (USPTO):Explore Patents

Title: Yuelin Zhao: Innovator in Wafer Bonding Technology

Introduction

Yuelin Zhao is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, particularly in wafer bonding methods. With a total of two patents to his name, Zhao's work is recognized for its innovative approaches to enhancing the efficiency and reliability of semiconductor devices.

Latest Patents

Yuelin Zhao's latest patents focus on a sealing structure for bonded wafers and the method of forming this sealing structure. The method involves providing both a lower wafer and an upper wafer, forming a sealing material layer on each, and creating a mask layer on the sealing material. The sealing material is then etched using the mask layer as an etch mask, resulting in the formation of protrusions on the edges of both wafers. These protrusions are bonded together to create a sealing structure that encloses a gap between the two wafers, ultimately forming a hermetically sealed cavity at the edge of the bonded wafer. This innovative sealing structure is crucial for improving the performance and longevity of semiconductor devices.

Career Highlights

Yuelin Zhao is currently employed at Semiconductor Manufacturing International Corporation (SMIC) in Shanghai. His work at SMIC has allowed him to apply his inventive skills in a practical setting, contributing to advancements in semiconductor manufacturing processes. Zhao's expertise in wafer bonding technology has positioned him as a valuable asset in the industry.

Collaborations

Throughout his career, Yuelin Zhao has collaborated with notable colleagues, including Yuankun Hou and Kuanchieh Yu. These collaborations have fostered a productive environment for innovation and have led to significant advancements in their respective fields.

Conclusion

Yuelin Zhao's contributions to wafer bonding technology exemplify the spirit of innovation in the semiconductor industry. His patents and work at SMIC highlight the importance of developing efficient methods for enhancing semiconductor device performance. Zhao's ongoing efforts continue to shape the future of technology in this critical field.

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