Taipei, Taiwan

Yueh Ming Liu

This inventor holds 3 USPTO granted patents. Top assignee: Super Micro Computer, Inc.. Active years: 2024-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yueh Ming Liu. Retrieved from https://idiyas.com/inventor/yueh-ming-liu-ts0cav7w

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.1

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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3 patents (USPTO):Explore Patents

Title: Innovations by Yueh Ming Liu in Fluid Immersion Cooling Systems

Introduction

Yueh Ming Liu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of cooling systems, particularly in the area of fluid immersion cooling technology. With a total of 3 patents to his name, Liu's work is paving the way for advancements in electronic system cooling.

Latest Patents

One of Liu's latest patents is a "Fluid immersion cooling system with multiple layers of coolant fluids and method of using same." This innovative system includes a fluid tank that contains a layer of a dual-phase coolant fluid and one or more layers of single-phase coolant fluids. The dual-phase and single-phase coolant fluids are immiscible, with the dual-phase coolant fluid having a lower boiling point and higher density than a single-phase coolant fluid. In this system, a substrate of an electronic system is submerged in the tank, allowing high heat-generating components to be immersed in the layer of the dual-phase coolant fluid. Heat from these components is dissipated to generate vapor bubbles, which rise to the layer of single-phase coolant fluid above. The vapor bubbles condense into droplets that fall back into the dual-phase coolant fluid layer.

Another significant patent by Liu is for "Dual-stacked motherboards for fluid immersion cooling." This design features a server computer system with one or more node assemblies. Each node assembly consists of two motherboards stacked one over the other, with their component sides facing each other. Memory cards mounted on one motherboard are interlaced with those on the other, allowing for efficient cooling as at least the processors of both motherboards are immersed in a coolant fluid within a fluid immersion cooling tank.

Career Highlights

Yueh Ming Liu is currently employed at Super Micro Computer, Inc., where he continues to innovate in the field of cooling technologies. His work has garnered attention for its potential to enhance the efficiency and performance of electronic systems.

Collaborations

Liu collaborates with talented individuals such as Yu Hsiang Huang and Yu Chuan Chang, contributing to a dynamic team focused on advancing cooling technologies.

Conclusion

Yueh Ming Liu's contributions to fluid immersion cooling systems represent a significant advancement in electronic cooling technology. His innovative patents and ongoing work at Super Micro Computer, Inc. highlight his role as a leading inventor in this

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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