Taipei, Taiwan

Yueh-Hui Lee

This inventor holds 3 USPTO granted patents. Top assignee: Yang Ji Co., Ltd.. Active years: 2021-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yueh-Hui Lee. Retrieved from https://idiyas.com/inventor/yueh-hui-lee

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2021-2025

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3 patents (USPTO):Explore Patents

Title: Innovations by Yueh-Hui Lee

Introduction

Yueh-Hui Lee is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electrical engineering, particularly in socket design. With a total of 3 patents to his name, his work reflects a commitment to improving electrical safety and functionality.

Latest Patents

Yueh-Hui Lee's latest patents include a modularized socket structure and a universal socket with polarity correction. The modularized socket structure features a main socket module with multiple jacks and an expansion socket module, enhancing versatility and usability. The universal socket with polarity correction incorporates a cover, wedging body, and shell, designed to ensure safe and efficient electrical connections.

Career Highlights

Yueh-Hui Lee is associated with Yang Ji Co., Ltd., where he applies his expertise in developing innovative electrical solutions. His work has garnered attention for its practicality and safety features, making a positive impact in the industry.

Collaborations

Yueh-Hui Lee collaborates with his coworker, Yueh-Ying Lee, who contributes to the innovative projects at Yang Ji Co., Ltd. Their partnership exemplifies the synergy between inventors in advancing technology.

Conclusion

Yueh-Hui Lee's contributions to socket design demonstrate his dedication to innovation and safety in electrical engineering. His patents reflect a forward-thinking approach that benefits both consumers and the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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