Hualien, Taiwan

Yueh Cheng Hsueh

This inventor holds 1 USPTO granted patent. Top assignee: Inotera Memories, Inc.. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yueh Cheng Hsueh. Retrieved from https://idiyas.com/inventor/yueh-cheng-hsueh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Innovations of Yueh Cheng Hsueh

Introduction

Yueh Cheng Hsueh is a notable inventor based in Hualien, Taiwan. He has made significant contributions to the field of wafer polishing technology. His innovative approach has led to the development of a unique pressure control system that enhances the efficiency of wafer polishing apparatuses.

Latest Patents

Yueh Cheng Hsueh holds a patent for a "Pressure control system of wafer polishing apparatus." This system includes a main input air pressure regulator, an air branch conduit, a plurality of first pipes, auxiliary air pressure regulators, second pipes, and air pressure controlling devices. The design allows for precise control of the pressure outputted from the polishing head to the surface of a wafer, ensuring optimal polishing results. He has 1 patent to his name.

Career Highlights

Yueh Cheng Hsueh is currently employed at Inotera Memories, Inc., where he continues to innovate in the field of semiconductor manufacturing. His work has been instrumental in improving the performance and reliability of wafer polishing processes.

Collaborations

Yueh Cheng Hsueh collaborates with talented professionals in his field, including Chin Wei Wu and Sheng-Feng Hung. Their combined expertise contributes to the advancement of technology in wafer processing.

Conclusion

Yueh Cheng Hsueh's contributions to the semiconductor industry through his innovative patent demonstrate his commitment to enhancing technology. His work continues to influence the efficiency of wafer polishing processes, marking him as a significant figure in his field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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