Yudan Deng

Title: Yudan Deng: Innovator in Chip Technology

Introduction

Yudan Deng is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of chip technology, holding a total of 2 patents. His work focuses on innovative methods for chip testing and design, which are crucial for advancing electronic devices.

Latest Patents

Yudan Deng's latest patents include a chip and a chip test method. The first patent describes a chip that comprises a receiver circuit and a test circuit. The receiver circuit features a signal receiving unit and a signal bump, which is coupled to the signal receiving unit. The test circuit is connected to a circuit node between the signal receiving unit and the signal bump. It includes a digital-to-analog converter, a first resistor, and a unit gain buffer. The configuration allows for efficient testing and signal processing.

The second patent also focuses on a chip and a chip testing method. This invention includes a sending terminal circuit and a test circuit. The sending terminal circuit consists of a signal sending unit and a first signal bump. Similar to the first patent, the test circuit is coupled to a circuit node between the signal sending unit and the first signal bump. It features a first resistor, a unit gain buffer, and an analog-to-digital converter, enabling precise testing and data conversion.

Career Highlights

Yudan Deng is currently employed at Shanghai Biren Technology Co., Ltd. His role involves developing cutting-edge technologies that enhance the performance and reliability of chips. His expertise in chip design and testing has positioned him as a valuable asset in the tech industry.

Collaborations

Yudan has collaborated with notable colleagues, including Jinfu Ye and Huan Liu. Their combined efforts contribute to the innovative projects at Shanghai Biren Technology Co., Ltd.

Conclusion

Yudan Deng is a key figure in the advancement of chip technology, with a focus on innovative testing methods. His contributions are shaping the future of electronic devices and enhancing their functionality.