Company Filing History:
Years Active: 2025
Title: Yuchi Yang: Innovator in Silicon-Based Packaging Technology
Introduction
Yuchi Yang is a prominent inventor based in Beijing, China. He has made significant contributions to the field of silicon-based packaging technology. His innovative work has led to the development of a unique fan-out package structure that enhances the efficiency of microchannel integration.
Latest Patents
Yuchi Yang holds a patent for a "Silicon-based fan out package structure and preparation method therefor." This patent describes a silicon-based fan-out package structure that includes embedded manifold type microchannels. The structure consists of a chip with a substrate and embedded microchannels located on the back of the substrate. It also features a silicon-based adapter plate with a groove for burying the chip, a manifold channel, a liquid inlet, and a liquid outlet. Additionally, a low-temperature sealing layer is used to seal the embedded microchannels with the manifold channel, and a rewiring layer is positioned at the top of the chip.
Career Highlights
Yuchi Yang is affiliated with Peking University, where he continues to advance his research and development efforts. His work has garnered attention for its innovative approach to packaging technology, particularly in the integration of microchannels.
Collaborations
Yuchi Yang collaborates with notable colleagues such as Wei Wang and Jianyu Du. Their combined expertise contributes to the advancement of research in silicon-based technologies.
Conclusion
Yuchi Yang's contributions to silicon-based packaging technology exemplify the innovative spirit of modern inventors. His patent and ongoing research at Peking University highlight the importance of advancements in this field.