Peking University

Yuchi Yang

Wei Wang

Jianyu Du

The present disclosure relates to a silicon-based fan out package structure including embedded manifold type microchannels, which includes: a chip, which includes a substrate and embedded microchannels located on a back of the substrate; a silicon-based adapter plate, which includes a groove for burying the chip, a manifold channel located below the groove and communicated with the groove, a liquid inlet and a liquid outlet; a low temperature sealing layer for sealing the embedded microchannels with the manifold channel, the low temperature sealing layer being located between the chip and the silicon-based adapter plate; and a rewiring layer at a top of the chip. The present disclosure also relates to a preparation method for a silicon-based fan out package structure including embedded manifold type microchannels.

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Beijing, China

Yuchi Yang