Zhengzhou, China

Yuanyuan Dong

This inventor holds 1 USPTO granted patent. Top assignee: China Academy of Machinery Zhengzhou Research Institute of Mechanical Engineering Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuanyuan Dong. Retrieved from https://idiyas.com/inventor/yuanyuan-dong-k6mpqqyt

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Yuanyuan Dong and Polymer-Coated Aluminum Bonding Wire.

Introduction

Yuanyuan Dong is an inventor associated with Zhengzhou, China, and the China Academy of Machinery Zhengzhou Research Institute of Mechanical Engineering Co., Ltd. Her patent work includes a design for aluminum bonding wire coated with a photo-curing polymer.

Latest Patents

Dong is named on 1 patent: “Aluminum Bonding Wire Coated by Photo-Curing Polymer, Preparation Method, and Application Therefor.” The invention describes aluminum-based material coated with an anodic aluminum oxide layer containing closely arrayed alumina micropores. A photo-curing polymer layer attaches within the micropores and across the surface of the microporous layer. The patent also addresses preparation of the coated wire and its applications.

Career Highlights

The patent highlights Dong’s work on combining anodic aluminum oxide structures with photo-curing polymers for aluminum bonding wire. The disclosed approach places polymer both inside the alumina micropores and on the layer’s surface.

Collaborations

Dong’s listed coworkers include Yafang Cheng and Sujuan Zhong. They are associated with the same patent work.

Conclusion

Yuanyuan Dong’s patent focuses on a polymer-coated aluminum bonding wire and its preparation and application, reflecting her contribution to materials and bonding-wire technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…