Company Filing History:
Years Active: 2017
Title: Innovations of Yuankun Hou in Semiconductor Technology
Introduction
Yuankun Hou is a prominent inventor based in Shanghai, China, known for his contributions to semiconductor technology. He holds two patents that showcase his expertise in the field. His work focuses on developing advanced sealing structures for bonded wafers, which are crucial in semiconductor manufacturing.
Latest Patents
Yuankun Hou's latest patents include a method for forming a sealing structure for a bonded wafer. This innovative method involves providing both a lower wafer and an upper wafer, forming a sealing material layer on each, and creating a mask layer for etching. The process results in the formation of protrusions on the edges of the wafers, which are then bonded together to create a hermetically sealed cavity. This sealing structure is essential for ensuring the integrity and performance of semiconductor devices.
Career Highlights
Yuankun Hou is currently employed at Semiconductor Manufacturing International Corporation, a leading company in the semiconductor industry. His work has significantly impacted the development of reliable and efficient semiconductor devices.
Collaborations
Yuankun collaborates with notable coworkers, including Kuanchieh Yu and Yu Hua, who contribute to the innovative projects at their company.
Conclusion
Yuankun Hou's contributions to semiconductor technology through his patents and work at Semiconductor Manufacturing International Corporation highlight his role as a key innovator in the field. His advancements in sealing structures for bonded wafers are vital for the future of semiconductor manufacturing.