Shanghai, China

Yuangen Yu


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: **Innovator Spotlight: Yuangen Yu - Pioneering Vacuumizing Technology**

Introduction

Yuangen Yu is an innovative inventor based in Shanghai, China, recognized for his contributions to the field of vacuumizing technology. With one registered patent to his name, he plays a significant role in enhancing bonding processes across various applications.

Latest Patents

Yuangen Yu's most notable patent is the "Vacuumizing device and vacuumizing method for bonding substrate." This invention features a sophisticated vacuumizing device that includes a vacuum chamber, a bonding fixture, and an efficient vacuumizing system. The bonding fixture is strategically designed with a substrate table that incorporates multiple grooves to retain substrates through suction. This method ensures that during the vacuumizing process, the vacuum level in the grooves is consistently smaller than or equal to that in the vacuum chamber. Such design optimizes substrate retention without warping, thereby significantly improving the quality of substrate bonding.

Career Highlights

Yuangen Yu is affiliated with Shanghai Micro Electronics Equipment (Group) Co., Ltd., where he leverages his expertise to drive innovation in electronic manufacturing equipment. Throughout his career, he has demonstrated a commitment to developing technologies that enhance operational efficiency and product quality.

Collaborations

Working alongside talented colleagues like Zhijun Huo and Bin Zhao, Yuangen Yu fosters a collaborative environment. Their shared expertise allows for the continuous advancement of their projects, further pushing the boundaries of what's possible in electronic manufacturing.

Conclusion

Yuangen Yu’s inventive spirit and pioneering patent contribute significantly to the field of vacuumizing technology. His work not only benefits his company but also sets a precedent for future innovations in bonding substrate methods, illustrating the profound impact of dedicated inventors in advancing technological horizons.

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