Company Filing History:
Years Active: 2005
Title: Innovations by Yuan-Ping Joe in Semiconductor Technology
Introduction
Yuan-Ping Joe is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the design and fabrication of semiconductor packages. His innovative approach has led to advancements that enhance the performance and efficiency of semiconductor devices.
Latest Patents
Yuan-Ping Joe holds a patent for a semiconductor package with enhanced chip groundability and a method of fabricating the same. This invention provides a solution where a ground pad on a chip is electrically connected to a ground plane on a substrate through an electrically-conductive wall and adhesive. This design simplifies the wire-bonding process, allowing for a reduced number of bonding wires and improving the electrical performance of the semiconductor package by shortening the grounding path.
Career Highlights
Yuan-Ping Joe is currently employed at Siliconware Precision Industries, Ltd., where he continues to innovate in semiconductor packaging technologies. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.
Collaborations
Yuan-Ping Joe has collaborated with notable colleagues such as Chin Fa Wang and Wen-Ta Tsai. Their combined expertise has contributed to the successful development of innovative semiconductor solutions.
Conclusion
Yuan-Ping Joe's contributions to semiconductor technology exemplify the impact of innovative thinking in the field. His patent and ongoing work at Siliconware Precision Industries, Ltd. highlight the importance of advancements in semiconductor packaging for improved electrical performance.