Taipei, Taiwan

Yuan-Chi Hsieh

This inventor holds 1 USPTO granted patent. Top assignee: Nan Ya Technology Corporation. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yuan-Chi Hsieh. Retrieved from https://idiyas.com/inventor/yuan-chi-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations of Yuan-Chi Hsieh

Introduction

Yuan-Chi Hsieh is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of polishing technology. His innovative approach has led to the development of a unique polishing delivery apparatus.

Latest Patents

Yuan-Chi Hsieh holds 1 patent for his invention titled "Polishing delivery apparatus." This apparatus is designed to provide slurry and rinse agents to a polishing pad. It features a delivery arm that is rotatably connected to the polishing pad, equipped with at least one first nozzle and at least one second nozzle. The design includes an arc-shaped top surface and a recess that enhances its functionality.

Career Highlights

Yuan-Chi Hsieh is associated with Nan Ya Technology Corporation, where he applies his expertise in polishing technology. His work has been instrumental in advancing the capabilities of polishing systems used in various applications.

Collaborations

Yuan-Chi has collaborated with talented coworkers such as Jiun-Bo Wang and Chia-Hung Su. Their combined efforts contribute to the innovative environment at Nan Ya Technology Corporation.

Conclusion

Yuan-Chi Hsieh's contributions to polishing technology exemplify the spirit of innovation. His patent for the polishing delivery apparatus showcases his commitment to enhancing industrial processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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