Taipei, Taiwan

Yu-Tung Hsing

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Miniwiz Co., Ltd.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Tung Hsing. Retrieved from https://idiyas.com/inventor/yu-tung-hsing

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Innovations by Yu-Tung Hsing

Introduction

Yu-Tung Hsing is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of building assembly through his innovative designs. His work focuses on enhancing the efficiency and functionality of structural components in construction.

Latest Patents

Yu-Tung Hsing holds a patent for a "Structural joint and sealing element for panels." This invention discloses a building assembly that includes a supporting member, a pair of first sealing members, an elastically deformable gasket, and a second sealing member. The design aims to improve the assembly of building panels, ensuring a secure and efficient connection.

Career Highlights

Hsing is associated with Miniwiz Co., Ltd., a company known for its commitment to sustainable innovation. His work at Miniwiz has allowed him to explore new technologies and materials that contribute to environmentally friendly construction practices.

Collaborations

Yu-Tung Hsing has collaborated with talented individuals such as Chian-Chi Huang and Tzu-Wei Liu. These partnerships have fostered a creative environment that encourages the development of groundbreaking solutions in the construction industry.

Conclusion

Yu-Tung Hsing's contributions to building assembly through his innovative patent demonstrate his commitment to advancing construction technology. His work continues to inspire future developments in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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