This inventor holds 1 USPTO granted patent. Top assignee: Aptina Imaging Corporation. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: The Innovations of Yu Te Hsieh
Introduction
Yu Te Hsieh is a prominent inventor based in Taoyuan, Taiwan. She has made significant contributions to the field of sensor technology. Her innovative work has led to the development of a unique patent that enhances the functionality of stacked chip packages.
Latest Patents
Yu Te Hsieh holds a patent for a "Stacked Sensor Packaging Structure and Method." This patent discloses a stacked chip package that includes an image sensor with a recess formed on its surface. Additionally, it features a digital signal processor chip positioned within this recess. The method of fabricating this stacked chip package involves forming a recess on the surface of the image sensor and positioning the digital signal processor in that recess.
Career Highlights
Yu Te Hsieh is currently employed at Aptina Imaging Corporation, where she continues to push the boundaries of imaging technology. Her work at the company has been instrumental in advancing sensor packaging solutions.
Collaborations
Yu Te Hsieh has collaborated with notable professionals in her field, including her coworker Larry Duane Kinsman. Their combined expertise has contributed to the success of various projects within the company.
Conclusion
Yu Te Hsieh's innovative contributions to sensor technology and her patent for a stacked sensor packaging structure exemplify her dedication to advancing the field. Her work continues to influence the development of imaging solutions in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile