Yu-Shiang Lin

Title: Innovations by Yu-Shiang Lin: A Focus on Damascene Structures

Introduction

Yu-Shiang Lin, an esteemed inventor hailing from Taipei Hsien, Taiwan, has made significant strides in the field of semiconductor technology. With a notable patent under his belt, Lin has contributed to the innovative landscape of electronics through his work at the renowned United Microelectronics Corporation (UMC).

Latest Patents

Lin's patent, titled "Method of forming damascene structures," represents a pioneering approach to semiconductor manufacturing. This invention involves providing a substrate with a dielectric layer embedded with multiple via holes. The process begins with the formation of a gap filler within each via hole. Following this, a first anti-reflective coating (ARC) film along with a second ARC film is applied to the dielectric layer. A photoresist pattern is then created on the second ARC film to define the desired trench pattern. The culmination of this process is an etching operation that removes the upper section of the dielectric layer that remains unprotected by the photoresist, ultimately forming numerous trenches. This innovative method enhances the efficiency and precision of semiconductor fabrication.

Career Highlights

Lin has established himself as a vital asset at United Microelectronics Corporation, a company known for its high-performance chips and cutting-edge technology. His work contributes toward pushing the boundaries of what is possible in semiconductor design and manufacturing. His educational background and professional journey detail a deep-rooted commitment to excellence in innovation.

Collaborations

Throughout his career, Lin has collaborated with talented colleagues such as Chun-Jen Weng and Chih-Yi Cheng. These partnerships foster an environment of creativity and shared knowledge, leading to breakthroughs in technological applications and advancing UMC’s competitive edge in the industry.

Conclusion

Yu-Shiang Lin exemplifies the spirit of innovation within the semiconductor realm. His patent on the method of forming damascene structures underscores his expertise and commitment to advancing technology. As Lin continues to explore new possibilities, his contributions will undoubtedly play a significant role in shaping the future of semiconductor manufacturing and electronics.