Company Filing History:
Years Active: 2019
Title: Innovations by Yu-Shiang Chen: A Visionary in Substrate Technology
Introduction
Yu-Shiang Chen is an esteemed inventor hailing from Taichung, Taiwan. He holds a notable patent focused on enhancing substrate technology, contributing to advancements in packaging modules used in electronics. His innovative approach exemplifies a commitment to improving the efficacy of interconnection layers in substrates.
Latest Patents
Yu-Shiang Chen's patent, titled "Substrate and Package Module Including the Same," represents a significant technological advancement. This patent details a substrate comprising a substrate body and an interconnection layer situated on a bearing surface of the substrate body. The design features an annular portion accompanied by a series of protrusions extending outward from its periphery. The innovation is in its ability to form a package module that includes a chip mounted on the substrate’s bearing surface, with a protective cap adhered to the interconnection layer by an adhesive. The protrusions notably enhance the bonding area of the adhesive, effectively improving adhesive concentration and spread.
Career Highlights
Yu-Shiang Chen currently works with Lingsen Precision Industries, Ltd., a company recognized for its innovative contributions to the electronics sector. His dedication and expertise in substrate technology have solidified his reputation as a valuable asset within the company.
Collaborations
Collaborating closely with esteemed colleagues such as Chao-Wei Yu and Yu-Lin Hsiao, Yu-Shiang Chen embodies the spirit of teamwork and innovation. Together, they contribute to the advancement of technology in their field, fostering an environment of creativity and excellence.
Conclusion
The contributions of Yu-Shiang Chen to substrate technology not only showcase his innovative mindset but also illustrate the collaborative effort within the field of electronics. His patent serves as a testament to the impact of inventive thinking in advancing technology, paving the way for future innovations in packaging modules.