Tianjin, China

Yu Qing Deng

This inventor holds 1 USPTO granted patent. Top assignee: Upper Echelon Products, LLC.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu Qing Deng. Retrieved from https://idiyas.com/inventor/yu-qing-deng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Yu Qing Deng: Innovator in Cushion Technology

Introduction

Yu Qing Deng is a notable inventor based in Tianjin, China. He has made significant contributions to the field of comfort technology, particularly with his innovative designs. His work focuses on enhancing user experience through practical inventions.

Latest Patents

Yu Qing Deng holds a patent for a back cushion, which aims to provide better support and comfort for users. This invention reflects his commitment to improving everyday products through thoughtful design. He has 1 patent to his name, showcasing his innovative spirit.

Career Highlights

Deng is currently employed at Upper Echelon Products, LLC, where he continues to develop and refine his ideas. His role allows him to collaborate with other professionals in the industry, further enhancing his skills and contributions to product development.

Collaborations

One of his notable coworkers is Joseph David Federl. Together, they work on various projects that aim to push the boundaries of comfort technology. Their collaboration exemplifies the importance of teamwork in the innovation process.

Conclusion

Yu Qing Deng is a dedicated inventor whose work in cushion technology has the potential to improve the quality of life for many individuals. His innovative approach and commitment to design excellence make him a valuable asset in the field of product development.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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