Yu-Kang Huang

Title: Innovations of Yu-Kang Huang in Semiconductor Processing

Introduction

Yu-Kang Huang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor processing, particularly through his innovative patent. His work is instrumental in advancing the technology used in the manufacturing of semiconductor devices.

Latest Patents

Yu-Kang Huang holds a patent for a semiconductor processing tool and methods of operation. This patent describes a physical vapor deposition tool that includes a magnet component, a single cathode, and a power circuit for biasing a pedestal that supports a semiconductor substrate. During the deposition operation, which deposits an inert metal material, the tool can modulate an electromagnetic field emanating from the magnet component. This component features spiral-shaped bands with varying ranges of magnetic strength. The design of this tool allows for increased throughput compared to traditional physical vapor deposition tools that lack these features. Additionally, the inert metal material deposited using this tool may exhibit a larger grain size compared to that deposited with conventional methods.

Career Highlights

Yu-Kang Huang is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His role in the company has allowed him to work on cutting-edge technologies that enhance semiconductor manufacturing processes. His innovative approach has positioned him as a key figure in the field.

Collaborations

Yu-Kang Huang has collaborated with notable colleagues, including Yen-Liang Lin and Yu-Chuan Tai. These collaborations have fostered an environment of innovation and have contributed to the advancement of semiconductor technologies.

Conclusion

Yu-Kang Huang's contributions to semiconductor processing through his innovative patent demonstrate his expertise and commitment to advancing technology in this critical field. His work continues to influence the industry and pave the way for future innovations.