Taipei, Taiwan

Yu-Hsuan Wang


Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015-2023

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2 patents (USPTO):Explore Patents

Title: Innovations of Yu-Hsuan Wang

Introduction

Yu-Hsuan Wang is a notable inventor based in New Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in the areas of operating systems and heat dissipation mechanisms. With a total of two patents to his name, Wang's work reflects a commitment to advancing technological solutions.

Latest Patents

Wang's latest patents include a "Method and system for labeling object and generating security policy of operating system." This innovative method is designed to label objects within a target operating system based on their attributes. The process involves generating a default label, obtaining a reference object, and comparing attributes to determine the appropriate labeling for the target object. His second patent, titled "Heat dissipation module," describes a system that includes a fan, heat sink, and heat pipe. This module effectively guides airflow to manage heat generated by components, ensuring optimal performance.

Career Highlights

Throughout his career, Yu-Hsuan Wang has worked with prominent companies such as Foxconn Technology Co., Ltd. and the Industrial Technology Research Institute. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of technology in various sectors.

Collaborations

Wang has collaborated with talented individuals in his field, including Chung-Kai Hsu and Chia-Yang Liu. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

In summary, Yu-Hsuan Wang is an accomplished inventor whose work in operating systems and heat dissipation technologies has made a significant impact. His patents demonstrate a deep understanding of technical challenges and innovative solutions.

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