Yu-Hsiang Chien

Title: Innovations of Yu-Hsiang Chien in Semiconductor Manufacturing

Introduction

Yu-Hsiang Chien is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative patent related to through silicon vias.

Latest Patents

Yu-Hsiang Chien holds a patent for a method of manufacturing a through silicon via (TSV). This patent includes steps for forming a TSV sacrificial structure in a substrate, which contacts a metal interconnect on the front side of the substrate. The process involves performing a backside thinning to expose the TSV sacrificial structure from the back side of the substrate, removing the sacrificial structure to create a through silicon hole, and filling this hole with conductive material to form a TSV. He has 1 patent to his name.

Career Highlights

Yu-Hsiang Chien is currently employed at Powerchip Semiconductor Manufacturing Corporation, where he continues to advance semiconductor technologies. His work has been instrumental in enhancing the efficiency and performance of semiconductor devices.

Collaborations

He has collaborated with notable colleagues such as Shih-Ping Lee and Tse-Hsien Wu, contributing to various projects within the semiconductor industry.

Conclusion

Yu-Hsiang Chien's innovative work in semiconductor manufacturing, particularly his patent on through silicon vias, showcases his expertise and commitment to advancing technology in this field. His contributions are vital for the ongoing development of efficient semiconductor solutions.