This inventor holds 1 USPTO granted patent. Top assignee: Wistron Neweb Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Yu-da Dong: Innovator in Semiconductor Packaging
Introduction
Yu-da Dong is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging. His innovative approach has led to the development of a unique package structure that enhances the performance and reliability of semiconductor devices.
Latest Patents
Yu-da Dong holds a patent for a "Package structure having second adhesive between side surface of semiconductor package and first adhesive." This patent describes a package structure and a method for fabricating the same. The package structure includes a substrate, a semiconductor package, a first adhesive, and a second adhesive. The substrate features a first board surface and a second board surface, with a second region surrounding a first region on the first board surface. The semiconductor package is positioned on the first board surface, and the first adhesive is applied in specific regions. The second adhesive is strategically placed between the side surface and the first adhesive, forming a pier adhesive that enhances the overall integrity of the package.
Career Highlights
Yu-da Dong is associated with Wistron Neweb Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in advancing packaging solutions that meet the demands of modern electronics.
Collaborations
Yu-da Dong has collaborated with notable colleagues, including Kuo-hua Hsieh and Chao-Chieh Chan. Their combined expertise has contributed to the successful development of innovative packaging solutions.
Conclusion
Yu-da Dong's contributions to semiconductor packaging exemplify the spirit of innovation in the technology sector. His patent and ongoing work at Wistron Neweb Corporation highlight his commitment to advancing the field.