Company Filing History:
Years Active: 2000-2005
Title: Innovations of Yu D Cong in Copper Sputtering Technology
Introduction
Yu D Cong is a notable inventor based in Sunnyvale, CA, who has made significant contributions to the field of semiconductor manufacturing. He holds a total of 6 patents that focus on advanced techniques for depositing copper layers in various applications. His work is particularly relevant in the context of high-performance electronic devices.
Latest Patents
Among his latest patents, Yu D Cong has developed a multi-step process for depositing a copper seed layer in a via. This process utilizes a DC magnetron sputter reactor designed for sputtering copper, with a focus on promoting self-ionized plasma (SIP) sputtering at pressures below 5 milliTorr, and ideally below 1 milliTorr. The SIP copper layer serves as a seed and nucleation layer for hole filling, which can be achieved through conventional sputtering (PVD) or electrochemical plating (ECP). For high aspect-ratio holes, a copper seed layer is deposited via chemical vapor deposition (CVD) over the SIP copper nucleation layer, with PVD or ECP completing the hole filling. Additionally, the copper seed layer may be deposited using a combination of SIP and high-density plasma sputtering techniques.
Career Highlights
Yu D Cong is currently employed at Applied Materials, Inc., a leading company in the semiconductor equipment industry. His innovative approaches to copper deposition have positioned him as a key figure in advancing manufacturing processes for electronic components.
Collaborations
Throughout his career, Yu D Cong has collaborated with esteemed colleagues such as Tony P Chiang and Peijun Ding. These partnerships have further enhanced the development and implementation of his patented technologies.
Conclusion
Yu D Cong's contributions to copper sputtering technology reflect his expertise and commitment to innovation in the semiconductor field. His patents not only advance manufacturing techniques but also pave the way for future developments in electronic device fabrication.