Company Filing History:

6 out of 13,684

Applied Materials, Inc.

patents

Years Active: 2000-2005

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6 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 6893541 - Multi-step process for depositing copper seed layer in a via (2005-05-17),

2. 6582569 - Process for sputtering copper in a self ionized plasma (2003-06-24),

3. 6413383 - Method for igniting a plasma in a sputter reactor (2002-07-02),

4. 6402806 - Method for unreacted precursor conversion and effluent removal (2002-06-11),

5. 6398929 - Plasma reactor and shields generating self-ionized plasma for sputtering (2002-06-04),

6. 6099649 - Chemical vapor deposition hot-trap for unreacted precursor conversion (2000-08-08),

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Company Filing History:

Years Active: 2000-2005