Company Filing History:
Years Active: 2020
Title: Innovations of Yu-Ching Tseng
Introduction
Yu-Ching Tseng is a notable inventor based in Keelung, Taiwan. He has made significant contributions to the field of additive manufacturing, showcasing his expertise through his innovative patents. With a total of 2 patents, Tseng continues to push the boundaries of technology and engineering.
Latest Patents
One of Yu-Ching Tseng's latest patents is an "Additive Manufacturing Chamber, Additive Manufacturing Module and Additive Manufacturing Apparatus Therewith." This apparatus features a main system and a cleaning transportation system that are separated from each other. The main system includes an additive manufacturing module, which contains an additive manufacturing chamber equipped with powder discharging openings and a vibration unit. The design allows for efficient powder discharge through gravitational force and vibration, addressing issues such as excessive energy consumption and environmental concerns related to powder haze.
Another significant patent is the "Curved Flow Channel with Built-in Lattice Structure." This innovation involves a lattice structure positioned at the outer inside wall of a curved section, which alters the flow rate and direction of fluid impacting the lattice. The geometry and distribution design of the lattice structure enable flow rate redistribution, resulting in a downstream flow field with uniform distribution.
Career Highlights
Yu-Ching Tseng is affiliated with the National Chung Shan Institute of Science and Technology, where he applies his knowledge and skills to advance research and development in his field. His work has garnered attention for its practical applications and innovative solutions.
Collaborations
Tseng collaborates with talented individuals such as Po-Shen Lin and Chih-Peng Chen, contributing to a dynamic research environment that fosters creativity and innovation.
Conclusion
Yu-Ching Tseng's contributions to additive manufacturing through his patents demonstrate his commitment to innovation and problem-solving in engineering. His work not only addresses current challenges but also paves the way for future advancements in the field.