This inventor holds 1 USPTO granted patent. Top assignee: Corning Incorporated. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yu Cheng and Substrate Edge-Surface Innovation
Introduction
Yu Cheng is an inventor associated with New Taipei City, Taiwan, and Corning Incorporated. His patent work includes a substrate design that specifies the geometry of an edge surface.
Latest Patents
Cheng is credited with 1 patent: “Substrate Comprising an Edge Surface.” The invention describes a first peripheral surface extending between a substrate’s first major surface and its outer peripheral surface. It defines ranges for the peripheral surface’s depth and width, along with ratios relating those dimensions to the substrate’s thickness and to each other. These specifications provide a structured approach to describing substrate-edge geometry.
Career Highlights
Cheng’s listed patent reflects work on substrate design and dimensional features. The patent identifies Corning Incorporated as the company with which he is associated.
Collaborations
Weirong Jiang is identified as Cheng’s coworker. The available information does not specify their roles in the patent or the nature of their collaboration.
Conclusion
Yu Cheng’s patent documents a substrate edge-surface design through defined dimensional ranges and proportions, highlighting his contribution to materials and substrate innovation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile