Hsinchu, Taiwan

Yu-Cheng Su

This inventor holds 1 USPTO granted patent. Top assignee: Mediatek Corporation. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Cheng Su. Retrieved from https://idiyas.com/inventor/yu-cheng-su-l872pmgn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Yu-Cheng Su: Innovator in Thermal Sensor Technology

Introduction

Yu-Cheng Su is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of thermal sensor technology. His innovative approach has led to the development of a unique processing circuit that integrates logic cells with a thermal sensor.

Latest Patents

Yu-Cheng Su holds a patent for an "Integration friendly thermal sensor." This invention provides a processing circuit that includes logic cells and a thermal sensor. The thermal sensor is strategically positioned within the logic cells and is surrounded by them. Both the logic cells and the thermal sensor are implemented using core devices. This design enhances the efficiency and functionality of thermal sensing in various applications.

Career Highlights

Yu-Cheng Su is currently associated with MediaTek Corporation, a leading global semiconductor company. His work at MediaTek focuses on advancing technologies that improve electronic devices' performance and efficiency. His innovative contributions have positioned him as a key player in the field of thermal sensor development.

Conclusion

Yu-Cheng Su's work exemplifies the spirit of innovation in the technology sector. His patent for an integration-friendly thermal sensor showcases his ability to merge functionality with advanced design. As he continues to contribute to the field, his impact on thermal sensor technology will undoubtedly be felt for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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