Zhongli, Taiwan

Yu-Cheng Liu

This inventor holds 1 USPTO granted patent. Top assignee: Ampower Technology Co., Ltd.. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Cheng Liu. Retrieved from https://idiyas.com/inventor/yu-cheng-liu-v4xgm6dg

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Innovations by Yu-Cheng Liu

Introduction

Yu-Cheng Liu is a notable inventor based in Jhongli, Taiwan. He has made significant contributions to the field of electrical engineering, particularly in the design of power adapters. His innovative approach has led to the development of a unique power adapter that enhances functionality and safety.

Latest Patents

Yu-Cheng Liu holds a patent for a "Socket and power adapter employing same." This invention includes a body and a socket received in the body. The socket defines a first hole, a second hole, and a third hole, which accommodate a live pin, a neutral pin, and a ground pin respectively. The arrangement of these pins along a straight line, with the neutral pin positioned between the live pin and the ground pin, showcases Liu's ingenuity in electrical design. He has 1 patent to his name.

Career Highlights

Yu-Cheng Liu is currently associated with Ampower Technology Co., Ltd. His work at this company has allowed him to focus on developing innovative solutions in power management and electrical safety. His contributions have been instrumental in advancing the technology used in power adapters.

Conclusion

Yu-Cheng Liu's inventive spirit and dedication to improving electrical devices have made him a valuable figure in the industry. His patent for a power adapter exemplifies his commitment to innovation and safety in electrical engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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