Yu-Che Liu

Title: Innovations of Yu-Che Liu in Semiconductor Packaging

Introduction

Yu-Che Liu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative solutions. His work focuses on enhancing the reliability and miniaturization of semiconductor packages.

Latest Patents

Yu-Che Liu holds a patent for a fabrication method of a semiconductor package. This invention includes a dielectric layer made of a material used for fabricating built-up layer structures. It features a conductive trace layer formed on the dielectric layer, with a semiconductor chip mounted on and electrically connected to the conductive trace layer. An encapsulant is formed over the dielectric layer to encapsulate both the semiconductor chip and the conductive trace layer. The strong bonding between the dielectric layer and the conductive trace layer prevents delamination, thereby improving reliability and facilitating package miniaturization.

Career Highlights

Yu-Che Liu is associated with Siliconware Precision Industries Co., Ltd., where he applies his innovative ideas to real-world applications. His work has been instrumental in advancing semiconductor technology, making significant strides in the industry.

Collaborations

Yu-Che Liu has collaborated with notable colleagues, including Chia-Cheng Chen and Chi-Ching Ho. These partnerships have contributed to the development of cutting-edge technologies in semiconductor packaging.

Conclusion

Yu-Che Liu's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to enhancing technology in this field. His work not only improves reliability but also supports the ongoing trend of miniaturization in electronics.