Yozo Uotsu

Title: Yozo Uotsu: Innovator in Packing Technology

Introduction

Yozo Uotsu is a notable inventor based in Nishinomiya, Japan. He has made significant contributions to the field of packing technology, particularly in the storage and handling of small parts. With a total of 2 patents to his name, Uotsu's innovations have had a considerable impact on the industry.

Latest Patents

Uotsu's latest patents include a packing band, packing method, and packing apparatus for small parts. This innovative band is designed to store small parts in multiple storing dents arranged along a longitudinal direction. It effectively packs these parts by covering the surfaces of the storing dents with a cover tape. The band is made from a flexible material that has a compress-forming nature, allowing it to be compress-formed from the surface to a fixed depth in the thickness direction. This design enhances the efficiency and reliability of packing small components.

Career Highlights

Throughout his career, Uotsu has worked with prominent companies such as Matsushita Electric Industrial Co., Ltd. and Nissho Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Uotsu has collaborated with notable coworkers, including Kazuhiro Mori and Eiji Itemadani. Their combined expertise has fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Yozo Uotsu's contributions to packing technology demonstrate his innovative spirit and dedication to improving the efficiency of small parts storage. His patents reflect a deep understanding of material properties and design principles, making him a significant figure in his field.