Hwaseong, South Korea

Younhwan Shin

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Younhwan Shin. Retrieved from https://idiyas.com/inventor/younhwan-shin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Younhwan Shin: Innovator in Dicing Blade Technology

Introduction

Younhwan Shin is a notable inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of dicing blade technology, particularly through his innovative patent.

Latest Patents

Younhwan Shin holds a patent for a dicing blade that includes diamond particles. This dicing blade features a first blade portion and a second blade portion that at least partially surrounds the first. The first blade portion consists of a first bonding layer, first diamond particles with a specific density, and first metal particles. The second blade portion includes a second bonding layer that surrounds the first bonding layer and contains second diamond particles with a higher density than the first.

Career Highlights

Younhwan Shin is currently employed at Samsung Electronics Co., Ltd., where he continues to develop innovative technologies. His work has contributed to advancements in the manufacturing processes of electronic components.

Collaborations

Some of his coworkers include Youngja Kim and Hyunggil Baek, who collaborate with him on various projects within the company.

Conclusion

Younhwan Shin's contributions to dicing blade technology exemplify his innovative spirit and dedication to advancing manufacturing techniques. His patent reflects a significant step forward in the efficiency and effectiveness of dicing blades.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…