Company Filing History:
2 out of 131,611 
2 out of 592 Years Active: 2024-2025
Title: Youngsuk Nam - Innovator in Composite Structures and Semiconductor Packages
Introduction
Youngsuk Nam is an inventor based in Daejeon, South Korea. He has made significant contributions to the fields of composite structures and semiconductor packaging. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
One of Youngsuk Nam's notable patent applications is for a composite structure. This composite structure includes a substrate with at least one void, a phase-change layer that fills a portion of the void, and an interface layer situated between the substrate and the phase-change layer. The substrate is made of copper (Cu), while the phase-change layer consists of gallium (Ga). The interface layer is composed of a copper gallium (CuGa) compound, which is in direct contact with both the substrate and the phase-change layer.
Another significant application is for a semiconductor package that features a heat dissipation member. This package includes a circuit board, a semiconductor chip mounted on the circuit board, and a heat dissipation member positioned adjacent to the semiconductor chip. A heat transmission member, which consists of a resin insulating body and phase change metal particles, connects the semiconductor chip to the heat dissipation member. The phase change metal particles are designed to effectively transmit heat generated by the semiconductor chip to the heat dissipation member.
Conclusion
Youngsuk Nam is an innovative inventor whose work in composite structures and semiconductor packages showcases his potential in the field of technology. His latest patent applications reflect a commitment to advancing materials and designs that could have significant implications in various industries.