This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Younghwan Jin: Innovator in Substrate Debonding Technology
Introduction
Younghwan Jin is a notable inventor based in Asan, South Korea. He has made significant contributions to the field of semiconductor technology, particularly with his innovative approaches to substrate debonding.
Latest Patents
Younghwan Jin holds a patent for a substrate debonding apparatus. This apparatus includes a chuck that is attached to a second surface opposite to the first surface of the semiconductor substrate via a second adhesive layer. The chuck is designed to support a lower portion of a base film, which has a cross-sectional area in a horizontal direction greater than that of the semiconductor substrate. Additionally, the apparatus features a fixing ring that secures the edge portion of the base film and a cover ring that adjusts the diameter of an opening exposing the carrier substrate. The cover ring is equipped with a guide frame and multiple cover blades that move horizontally.
Career Highlights
Younghwan Jin is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work focuses on advancing semiconductor technologies, which are crucial for modern electronic devices.
Collaborations
He has collaborated with talented coworkers, including Jonghyeon Chang and Hyunah Kim, who contribute to the innovative environment at Samsung Electronics.
Conclusion
Younghwan Jin's contributions to substrate debonding technology exemplify his commitment to innovation in the semiconductor field. His work continues to influence advancements in electronics, showcasing the importance of inventive minds in technology development.