Daejeon, South Korea

Young-Se Kwon


Average Co-Inventor Count = 2.1

ph-index = 5

Forward Citations = 130(Granted Patents)


Location History:

  • Taejon, KR (1998 - 1999)
  • Daejeon, KR (2002 - 2012)

Company Filing History:


Years Active: 1998-2012

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9 patents (USPTO):Explore Patents

Title: Young-Se Kwon: Innovator in Photonic Device Technology

Introduction

Young-Se Kwon is a prominent inventor based in Daejeon, South Korea. He has made significant contributions to the field of photonic devices, holding a total of 9 patents. His innovative work focuses on improving the efficiency and functionality of photonic device packaging.

Latest Patents

One of his latest patents is a metal-based photonic device package module. This module is designed to greatly enhance heat releasing efficiency while implementing a thin package. It includes a metal substrate shaped like a plate, a metal oxide layer with a mounting cavity, a photonic device mounted within this cavity, and a reflecting plane on the inner surface of the mounting cavity. Another notable patent is a method of fabricating a passive device applied to a three-dimensional package module. This invention features an aluminum substrate, an aluminum oxide layer with openings, a semiconductor device mounted using adhesive, and an organic layer covering the components.

Career Highlights

Throughout his career, Young-Se Kwon has worked with notable organizations such as Wavenics Inc. and the Korea Advanced Institute of Science and Technology. His experience in these institutions has allowed him to develop cutting-edge technologies in the field of photonics.

Collaborations

Young-Se Kwon has collaborated with several talented individuals, including Kyoung-Min Kim and In-Ho Jeong. These partnerships have contributed to the advancement of his innovative projects.

Conclusion

Young-Se Kwon's contributions to photonic device technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in device packaging and fabrication.

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